UNISOC T310 gegen UNISOC T616. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  UNISOC 4G UNISOC 4G
• CPU Gruppe
  UNISOC 4G 12nm UNISOC 4G 12nm
• Segment
  Mobile Mobile
• Generation
  0 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Cortex-A75 2x Cortex-A75
• B-Core
  3x Cortex-A55 6x Cortex-A55
• Hyperthreading / SMT
  Nein Nein
• Übertaktung
  Nein Nein
• A-Core Frequency
  2.00 GHz 2.00 GHz
• B-Core Frequency
  1.80 GHz 1.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  PowerVR GE8300 ARM Mali-G57 MP1
• GPU frequency
  0.80 GHz 0.75 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  1 2
• Shader
  0 32
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generation
  Vallhall 1
• Direct X
  10 12
• technisches verfahren
  20 nm 7 nm
• Datum der Veröffentlichung
  Q1/2017 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Nein Decode / Encode
• VP8
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• AV1
  Nein Decode
• AVC
  Nein Decode / Encode
• VC-1
  Nein Decode / Encode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by UNISOC T616 und UNISOC T310. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-933LPDDR4-1333LPDDR4X-1333 LPDDR4X-1866
• Max. Speicher
  --
• Speicherkanäle
  0 --
• ECC
  Nein Nein
• PCIe
  --
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of UNISOC T310 und UNISOC T616 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1 / PBP)
  --

Information on architecture, interfaces, and additional instructions supported by UNISOC T310 und UNISOC T616, including virtual machine technologies and fabrication processes.

• technisches verfahren
  12 nm 12 nm
• Chip design
  --
• Architektur
  --
• Operating systems
  Android Android
• Virtualisierung
  None None
• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA-Erweiterungen
  --
• Datum der Veröffentlichung
  Q2/2019 Q3/2021
• Spezifikation
  Technical data sheet Technical data sheet