UNISOC T310 vs UNISOC T616. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  UNISOC 4G UNISOC 4G
• CPU group
  UNISOC 4G 12nm UNISOC 4G 12nm
• Segment
  Mobile Mobile
• Generation
  0 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Cortex-A75 2x Cortex-A75
• B-Core
  3x Cortex-A55 6x Cortex-A55
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  2.00 GHz 2.00 GHz
• B-Core Frequency
  1.80 GHz 1.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  PowerVR GE8300 ARM Mali-G57 MP1
• GPU frequency
  0.80 GHz 0.75 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  1 2
• Shader
  0 32
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generation
  Vallhall 1
• Direct X
  10 12
• Technology
  20 nm 7 nm
• Release date
  Q1/2017 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by UNISOC T616 and UNISOC T310. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR3-933LPDDR4-1333LPDDR4X-1333 LPDDR4X-1866
• Max. Memory
  --
• Memory channels
  0 --
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of UNISOC T310 and UNISOC T616 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1 / PBP)
  --

Information on architecture, interfaces, and additional instructions supported by UNISOC T310 and UNISOC T616, including virtual machine technologies and fabrication processes.

• Technology
  12 nm 12 nm
• Chip design
  --
• Architecture
  --
• Operating systems
  Android Android
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  --
• Release date
  Q2/2019 Q3/2021
• Documents
  Technical data sheet Technical data sheet