Apple A8X kontra HiSilicon Kirin 935. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Apple A series HiSilicon Kirin
• Pokolenie
  8 3
• Grupa CPU
  Apple A8/A8X HiSilicon Kirin 930
• Successor
  Apple A9X --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.50 GHz 1.50 GHz
• Rdzenie CPU
  3 8
• Turbo (1 rdzeń)
  No turbo 2.20 GHz
• CPU Threads
  3 8
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  normal hybrid (big.LITTLE)
• A core
  3x Typhoon 4x Cortex-A53
• B core
  -- 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Apple A8X ARM Mali-T628 MP4
• GPU frequency
  0.45 GHz 0.68 GHz
• GPU (Turbo)
  No turbo 0.68 GHz
• Jednostki wykonawcze
  8 4
• Shader
  256 64
• Max. GPU Memory
  4 GB --
• Max. displays
  1 1
• Pokolenie
  5 Midgard 2
• DirectX Version
  11
• Proces technologiczny
  20 nm 32nm
• Data wydania
  Q3/2014 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode Decode / Encode
• VP9
  Nie Nie
• VP8
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Decode Nie
• VC-1
  Decode Nie
• JPEG
  Decode / Encode Nie

Overview of the types and quantities of RAM supported by HiSilicon Kirin 935 oraz Apple A8X. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-1600 LPDDR3-1600
• Max. Pamięć
  4 GB
• ECC
  Nie Nie
• Kanały pamięci
  2 2

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Apple A8X oraz HiSilicon Kirin 935 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  8 W

Information on architecture, interfaces, and additional instructions supported by Apple A8X oraz HiSilicon Kirin 935, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  4.00 MB --
• Architektura
  A8 Cortex-A53 / Cortex-A53
• Proces technologiczny
  20 nm 28 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2014 Q1/2015