Apple A8X contre HiSilicon Kirin 935. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Apple A series HiSilicon Kirin
• Génération
  8 3
• Groupe de CPU
  Apple A8/A8X HiSilicon Kirin 930
• Successor
  Apple A9X --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.50 GHz 1.50 GHz
• Cœurs de CPU
  3 8
• Turbo (1 cœur)
  Pas de turbo 2.20 GHz
• Fils de processeur
  3 8
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  normal hybrid (big.LITTLE)
• A core
  3x Typhoon 4x Cortex-A53
• B core
  -- 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Apple A8X ARM Mali-T628 MP4
• GPU frequency
  0.45 GHz 0.68 GHz
• GPU (Turbo)
  Pas de turbo 0.68 GHz
• Unités d'exécution
  8 4
• Shader
  256 64
• Max. GPU Memory
  4 GB --
• Max. displays
  1 1
• Génération
  5 Midgard 2
• DirectX Version
  11
• Processus technologique
  20 nm 32nm
• Date de sortie
  Q3/2014 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Decode Decode / Encode
• VP9
  Non Non
• VP8
  Non Decode / Encode
• AV1
  Non Non
• AVC
  Decode Non
• VC-1
  Decode Non
• JPEG
  Decode / Encode Non

Overview of the types and quantities of RAM supported by HiSilicon Kirin 935 et Apple A8X. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-1600 LPDDR3-1600
• Max. Mémoire
  4 GB
• ECC
  Non Non
• Canaux de mémoire
  2 2

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Apple A8X et HiSilicon Kirin 935 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  8 W

Information on architecture, interfaces, and additional instructions supported by Apple A8X et HiSilicon Kirin 935, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  4.00 MB --
• Architecture
  A8 Cortex-A53 / Cortex-A53
• Processus technologique
  20 nm 28 nm
• Socket
  N/A N/A
• Date de sortie
  Q3/2014 Q1/2015