Apple A8X 对 HiSilicon Kirin 935. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Apple A series HiSilicon Kirin
• 一代人
  8 3
• CPU组
  Apple A8/A8X HiSilicon Kirin 930
• Successor
  Apple A9X --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.50 GHz 1.50 GHz
• CPU核数
  3 8
• 涡轮增压 (1核)
  没有涡轮增压 2.20 GHz
• CPU线程
  3 8
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  normal hybrid (big.LITTLE)
• A core
  3x Typhoon 4x Cortex-A53
• B core
  -- 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Apple A8X ARM Mali-T628 MP4
• GPU frequency
  0.45 GHz 0.68 GHz
• GPU (Turbo)
  没有涡轮增压 0.68 GHz
• 执行单位
  8 4
• 着色器
  256 64
• Max. GPU Memory
  4 GB --
• Max. displays
  1 1
• 一代人
  5 Midgard 2
• DirectX Version
  11
• 技术过程
  20 nm 32nm
• 发布日期
  Q3/2014 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 没有
• h265 / HEVC (10 bit)
  没有 没有
• h264
  Decode Decode / Encode
• VP9
  没有 没有
• VP8
  没有 Decode / Encode
• AV1
  没有 没有
• AVC
  Decode 没有
• VC-1
  Decode 没有
• JPEG
  Decode / Encode 没有

Overview of the types and quantities of RAM supported by HiSilicon Kirin 935 和 Apple A8X. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR3-1600 LPDDR3-1600
• 最大内存
  4 GB
• ECC
  没有 没有
• 记忆通道
  2 2

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Apple A8X 和 HiSilicon Kirin 935 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  8 W

Information on architecture, interfaces, and additional instructions supported by Apple A8X 和 HiSilicon Kirin 935, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  2.00 MB --
• L2-Cache
  4.00 MB --
• 建筑学
  A8 Cortex-A53 / Cortex-A53
• 技术过程
  20 nm 28 nm
• 插座
  N/A N/A
• 发布日期
  Q3/2014 Q1/2015