HiSilicon Kirin 710 kontra Samsung Exynos 5420. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin Samsung Exynos
• Pokolenie
  5 3
• Grupa CPU
  HiSilicon Kirin 710 Samsung Exynos 5260/5410/5420/5422/5800

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.70 GHz 1.30 GHz
• Turbo (1 rdzeń)
  2.20 GHz 1.90 GHz
• Turbo (8 Cores)
  2.20 GHz 1.90 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G51 MP4 ARM Mali-T628 MP6
• GPU frequency
  0.65 GHz 0.53 GHz
• GPU (Turbo)
  1.00 GHz No turbo
• Jednostki wykonawcze
  8 6
• Shader
  128 96
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• Pokolenie
  Bifrost 1 Midgard 2
• Proces technologiczny
  12 nm 32nm
• Data wydania
  Q2/2018 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Nie
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nie Nie
• AVC
  Decode / Encode Nie
• VC-1
  Decode / Encode Nie
• JPEG
  Decode / Encode Nie

Overview of the types and quantities of RAM supported by Samsung Exynos 5420 oraz HiSilicon Kirin 710. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3LPDDR4 LPDDR3e-933
• Max. Pamięć
  6 GB
• ECC
  Nie Nie
• Kanały pamięci
  2 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 710 oraz Samsung Exynos 5420 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 710 oraz Samsung Exynos 5420, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv7-A32 (32 bit)
• Wirtualizacja
  None None
• L2-Cache
  -- 2.50 MB
• L3-Cache
  1.00 MB --
• Architektura
  Cortex-A73 / Cortex-A53 Cortex-A15 / Cortex-A7
• Proces technologiczny
  12 nm 28 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2018 Q3/2013