HiSilicon Kirin 710 对 Samsung Exynos 5420. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  HiSilicon Kirin Samsung Exynos
• 一代人
  5 3
• CPU组
  HiSilicon Kirin 710 Samsung Exynos 5260/5410/5420/5422/5800

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.70 GHz 1.30 GHz
• 涡轮增压 (1核)
  2.20 GHz 1.90 GHz
• Turbo (8 Cores)
  2.20 GHz 1.90 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G51 MP4 ARM Mali-T628 MP6
• GPU frequency
  0.65 GHz 0.53 GHz
• GPU (Turbo)
  1.00 GHz 没有涡轮增压
• 执行单位
  8 6
• 着色器
  128 96
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• 一代人
  Bifrost 1 Midgard 2
• 技术过程
  12 nm 32nm
• 发布日期
  Q2/2018 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode 没有
• h265 / HEVC (10 bit)
  没有 没有
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode 没有
• VP8
  Decode / Encode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode / Encode 没有
• VC-1
  Decode / Encode 没有
• JPEG
  Decode / Encode 没有

Overview of the types and quantities of RAM supported by Samsung Exynos 5420 和 HiSilicon Kirin 710. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR3LPDDR4 LPDDR3e-933
• 最大内存
  6 GB
• ECC
  没有 没有
• 记忆通道
  2 0

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 710 和 Samsung Exynos 5420 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 710 和 Samsung Exynos 5420, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv7-A32 (32 bit)
• 虚拟化
  None None
• L2-Cache
  -- 2.50 MB
• L2-Cache
  1.00 MB --
• 建筑学
  Cortex-A73 / Cortex-A53 Cortex-A15 / Cortex-A7
• 技术过程
  12 nm 28 nm
• 插座
  N/A N/A
• 发布日期
  Q3/2018 Q3/2013