HiSilicon Kirin 710 versus Samsung Exynos 5420. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  HiSilicon Kirin Samsung Exynos
• Geração
  5 3
• Grupo CPU
  HiSilicon Kirin 710 Samsung Exynos 5260/5410/5420/5422/5800

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.70 GHz 1.30 GHz
• Turbo (1 núcleo)
  2.20 GHz 1.90 GHz
• Turbo (8 Cores)
  2.20 GHz 1.90 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G51 MP4 ARM Mali-T628 MP6
• GPU frequency
  0.65 GHz 0.53 GHz
• GPU (Turbo)
  1.00 GHz Sem turbo
• Unidades de execução
  8 6
• Shader
  128 96
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• Geração
  Bifrost 1 Midgard 2
• Processo técnico
  12 nm 32nm
• Data de lançamento
  Q2/2018 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Não
• h265 / HEVC (10 bit)
  Não Não
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Não
• VP8
  Decode / Encode Decode / Encode
• AV1
  Não Não
• AVC
  Decode / Encode Não
• VC-1
  Decode / Encode Não
• JPEG
  Decode / Encode Não

Overview of the types and quantities of RAM supported by Samsung Exynos 5420 e HiSilicon Kirin 710. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR3LPDDR4 LPDDR3e-933
• Máx. Memória
  6 GB
• ECC
  Não Não
• Canais de memória
  2 0

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 710 e Samsung Exynos 5420 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 710 e Samsung Exynos 5420, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv7-A32 (32 bit)
• Virtualização
  None None
• Кеш L2
  -- 2.50 MB
• Кеш L3
  1.00 MB --
• Arquitectura
  Cortex-A73 / Cortex-A53 Cortex-A15 / Cortex-A7
• Processo técnico
  12 nm 28 nm
• Socket
  N/A N/A
• Data de lançamento
  Q3/2018 Q3/2013