Qualcomm Snapdragon 610 对 MediaTek Helio X27. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Mediatek Helio
• CPU组
  Qualcomm Snapdragon 610 MediaTek Helio X20
• 分段
  Mobile Mobile
• 一代人
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 10 / 10
• 核心架构
  normal hybrid (Prime / big.LITTLE)
• A-Core
  -- 2x Cortex-A72
• B-Core
  -- 4x Cortex-A53
• C-Core
  -- 4x Cortex-A53
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 405 ARM Mali-T880 MP4
• GPU frequency
  0.55 GHz 0.88 GHz
• GPU (Turbo)
  0.55 GHz 0.88 GHz
• 执行单位
  0 4
• 着色器
  48 64
• Max. displays
  0 2
• 一代人
  4 Midgard 4
• Direct X
  11 11
• 技术过程
  28 nm 16 nm
• 发布日期
  Q1/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  没有 Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  没有 Decode / Encode
• VP9
  没有 没有
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  Decode 没有
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio X27 和 Qualcomm Snapdragon 610. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR3-800 LPDDR3-800
• 最大内存
  4 GB
• 记忆通道
  1 2
• ECC
  没有 没有
• PCIe
  --
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 610 和 MediaTek Helio X27 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 610 和 MediaTek Helio X27, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA扩展
  --
• 建筑学
  Cortex-A53 Cortex-A72 / Cortex-A53
• 技术过程
  28 nm 20 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q3/2014 Q1/2017
• Part Number
  MSM8936 MT6797X