Qualcomm Snapdragon 610 gegen MediaTek Helio X27. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Helio
• CPU Gruppe
  Qualcomm Snapdragon 610 MediaTek Helio X20
• Segment
  Mobile Mobile
• Generation
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 10 / 10
• Zentrale Architektur
  normal hybrid (Prime / big.LITTLE)
• A-Core
  -- 2x Cortex-A72
• B-Core
  -- 4x Cortex-A53
• C-Core
  -- 4x Cortex-A53
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 405 ARM Mali-T880 MP4
• GPU frequency
  0.55 GHz 0.88 GHz
• GPU (Turbo)
  0.55 GHz 0.88 GHz
• Ausführungseinheiten
  0 4
• Shader
  48 64
• Max. displays
  0 2
• Generation
  4 Midgard 4
• Direct X
  11 11
• technisches verfahren
  28 nm 16 nm
• Datum der Veröffentlichung
  Q1/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nein Decode / Encode
• VP9
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio X27 und Qualcomm Snapdragon 610. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-800 LPDDR3-800
• Max. Speicher
  4 GB
• Speicherkanäle
  1 2
• ECC
  Nein Nein
• PCIe
  --
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 610 und MediaTek Helio X27 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 610 und MediaTek Helio X27, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA-Erweiterungen
  --
• Architektur
  Cortex-A53 Cortex-A72 / Cortex-A53
• technisches verfahren
  28 nm 20 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2014 Q1/2017
• Part Number
  MSM8936 MT6797X