Qualcomm Snapdragon 610 contra MediaTek Helio X27. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Helio
• Grupo CPU
  Qualcomm Snapdragon 610 MediaTek Helio X20
• Segmento
  Mobile Mobile
• Generación
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 10 / 10
• Arquitectura del núcleo
  normal hybrid (Prime / big.LITTLE)
• A-Core
  -- 2x Cortex-A72
• B-Core
  -- 4x Cortex-A53
• C-Core
  -- 4x Cortex-A53
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 405 ARM Mali-T880 MP4
• GPU frequency
  0.55 GHz 0.88 GHz
• GPU (Turbo)
  0.55 GHz 0.88 GHz
• Unidades de ejecución
  0 4
• Shader
  48 64
• Max. displays
  0 2
• Generación
  4 Midgard 4
• Direct X
  11 11
• Proceso técnico
  28 nm 16 nm
• Fecha de publicación
  Q1/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  Decode No
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio X27 y Qualcomm Snapdragon 610. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-800 LPDDR3-800
• Max. Memoria
  4 GB
• Canales de memoria
  1 2
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 610 y MediaTek Helio X27 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 610 y MediaTek Helio X27, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensiones ISA
  --
• Arquitectura
  Cortex-A53 Cortex-A72 / Cortex-A53
• Proceso técnico
  28 nm 20 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  Q3/2014 Q1/2017
• Part Number
  MSM8936 MT6797X