HiSilicon Kirin 620 contra HiSilicon Kirin 9000E. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generación
  3 9
• Grupo CPU
  HiSilicon Kirin 620 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.20 GHz 2.04 GHz
• Núcleos de CPU
  4 8
• Turbo (1 núcleo)
  1.20 GHz 3.13 GHz
• Hilos de la CPU
  4 8
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-450 MP4 ARM Mali-G78 MP22
• GPU frequency
  0.53 GHz 0.76 GHz
• GPU (Turbo)
  0.53 GHz sin turbo
• Unidades de ejecución
  4 22
• Shader
  64 352
• Max. displays
  1 1
• Generación
  Utgard Vallhall 2
• DirectX Version
  0 12
• Proceso técnico
  28nm 5 nm
• Fecha de publicación
  2012 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000E y HiSilicon Kirin 620. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3 LPDDR4X-2133LPDDR5-2750
• ECC
  No No
• Canales de memoria
  1 4

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 620 y HiSilicon Kirin 9000E to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 620 y HiSilicon Kirin 9000E, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• Arquitectura
  Cortex-A53 Cortex-A77 / Cortex-A55
• Proceso técnico
  28 nm 5 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q1/2015 Q4/2020