HiSilicon Kirin 620 vs HiSilicon Kirin 9000E. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  HiSilicon Kirin HiSilicon Kirin
• 세대
  3 9
• CPU 그룹
  HiSilicon Kirin 620 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.20 GHz 2.04 GHz
• CPU 코어
  4 8
• Turbo (1 Core)
  1.20 GHz 3.13 GHz
• CPU 스레드
  4 8
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-450 MP4 ARM Mali-G78 MP22
• GPU frequency
  0.53 GHz 0.76 GHz
• GPU (Turbo)
  0.53 GHz 터보 없음
• 실행 단위
  4 22
• Shader
  64 352
• Max. displays
  1 1
• 세대
  Utgard Vallhall 2
• DirectX Version
  0 12
• 기술
  28nm 5 nm
• 릴리스 날짜
  2012 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  아니요 Decode / Encode
• h265 / HEVC (10 bit)
  아니요 Decode / Encode
• h264
  아니요 Decode / Encode
• VP9
  아니요 Decode / Encode
• VP8
  아니요 Decode / Encode
• AV1
  아니요 Decode
• AVC
  아니요 Decode / Encode
• VC-1
  아니요 Decode / Encode
• JPEG
  아니요 Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000E 그리고 HiSilicon Kirin 620. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR3 LPDDR4X-2133LPDDR5-2750
• ECC
  아니요 아니요
• 메모리 채널
  1 4

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 620 그리고 HiSilicon Kirin 9000E to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 620 그리고 HiSilicon Kirin 9000E, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• 아키텍처
  Cortex-A53 Cortex-A77 / Cortex-A55
• 기술
  28 nm 5 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q1/2015 Q4/2020