HiSilicon Kirin 620 gegen HiSilicon Kirin 9000E. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generation
  3 9
• CPU Gruppe
  HiSilicon Kirin 620 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.20 GHz 2.04 GHz
• CPU Kerne
  4 8
• Turbo (1 Kern)
  1.20 GHz 3.13 GHz
• CPU Threads
  4 8
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-450 MP4 ARM Mali-G78 MP22
• GPU frequency
  0.53 GHz 0.76 GHz
• GPU (Turbo)
  0.53 GHz kein Turbo
• Ausführungseinheiten
  4 22
• Shader
  64 352
• Max. displays
  1 1
• Generation
  Utgard Vallhall 2
• DirectX Version
  0 12
• technisches verfahren
  28nm 5 nm
• Datum der Veröffentlichung
  2012 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• VP8
  Nein Decode / Encode
• AV1
  Nein Decode
• AVC
  Nein Decode / Encode
• VC-1
  Nein Decode / Encode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000E und HiSilicon Kirin 620. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3 LPDDR4X-2133LPDDR5-2750
• ECC
  Nein Nein
• Speicherkanäle
  1 4

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 620 und HiSilicon Kirin 9000E to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 620 und HiSilicon Kirin 9000E, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• Architektur
  Cortex-A53 Cortex-A77 / Cortex-A55
• technisches verfahren
  28 nm 5 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2015 Q4/2020