HiSilicon Kirin 620 contre HiSilicon Kirin 9000E. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin HiSilicon Kirin
• Génération
  3 9
• Groupe de CPU
  HiSilicon Kirin 620 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.20 GHz 2.04 GHz
• Cœurs de CPU
  4 8
• Turbo (1 cœur)
  1.20 GHz 3.13 GHz
• Fils de processeur
  4 8
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-450 MP4 ARM Mali-G78 MP22
• GPU frequency
  0.53 GHz 0.76 GHz
• GPU (Turbo)
  0.53 GHz Pas de turbo
• Unités d'exécution
  4 22
• Shader
  64 352
• Max. displays
  1 1
• Génération
  Utgard Vallhall 2
• DirectX Version
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 12
• Processus technologique
  28nm 5 nm
• Date de sortie
  2012 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode / Encode
• h264
  Non Decode / Encode
• VP9
  Non Decode / Encode
• VP8
  Non Decode / Encode
• AV1
  Non Decode
• AVC
  Non Decode / Encode
• VC-1
  Non Decode / Encode
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000E et HiSilicon Kirin 620. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3 LPDDR4X-2133LPDDR5-2750
• ECC
  Non Non
• Canaux de mémoire
  1 4

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 620 et HiSilicon Kirin 9000E to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 620 et HiSilicon Kirin 9000E, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A53 Cortex-A77 / Cortex-A55
• Processus technologique
  28 nm 5 nm
• Socket
  N/A N/A
• Date de sortie
  Q1/2015 Q4/2020