HiSilicon Kirin 620 contro HiSilicon Kirin 9000E. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generazione
  3 9
• Gruppo CPU
  HiSilicon Kirin 620 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  1.20 GHz 2.04 GHz
• Core della CPU
  4 8
• Turbo (1 Core)
  1.20 GHz 3.13 GHz
• Threads della CPU
  4 8
• Hyperthreading
  No No
• Overclock
  No No
• Architettura di base
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-450 MP4 ARM Mali-G78 MP22
• GPU frequency
  0.53 GHz 0.76 GHz
• GPU (Turbo)
  0.53 GHz No turbo
• Unità di esecuzione
  4 22
• Shader
  64 352
• Max. displays
  1 1
• Generazione
  Utgard Vallhall 2
• DirectX Version
  0 12
• Processo tecnico
  28nm 5 nm
• Data di rilascio
  2012 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000E e HiSilicon Kirin 620. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3 LPDDR4X-2133LPDDR5-2750
• ECC
  No No
• Canali di memoria
  1 4

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 620 e HiSilicon Kirin 9000E to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 620 e HiSilicon Kirin 9000E, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualizzazione
  None None
• Architettura
  Cortex-A53 Cortex-A77 / Cortex-A55
• Processo tecnico
  28 nm 5 nm
• Presa
  N/A N/A
• Data di rilascio
  Q1/2015 Q4/2020