HiSilicon Kirin 620 kontra HiSilicon Kirin 9000E. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin HiSilicon Kirin
• Pokolenie
  3 9
• Grupa CPU
  HiSilicon Kirin 620 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.20 GHz 2.04 GHz
• Rdzenie CPU
  4 8
• Turbo (1 rdzeń)
  1.20 GHz 3.13 GHz
• CPU Threads
  4 8
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-450 MP4 ARM Mali-G78 MP22
• GPU frequency
  0.53 GHz 0.76 GHz
• GPU (Turbo)
  0.53 GHz No turbo
• Jednostki wykonawcze
  4 22
• Shader
  64 352
• Max. displays
  1 1
• Pokolenie
  Utgard Vallhall 2
• DirectX Version
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 12
• Proces technologiczny
  28nm 5 nm
• Data wydania
  2012 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Nie Decode / Encode
• VP9
  Nie Decode / Encode
• VP8
  Nie Decode / Encode
• AV1
  Nie Decode
• AVC
  Nie Decode / Encode
• VC-1
  Nie Decode / Encode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000E oraz HiSilicon Kirin 620. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3 LPDDR4X-2133LPDDR5-2750
• ECC
  Nie Nie
• Kanały pamięci
  1 4

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 620 oraz HiSilicon Kirin 9000E to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 620 oraz HiSilicon Kirin 9000E, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Cortex-A53 Cortex-A77 / Cortex-A55
• Proces technologiczny
  28 nm 5 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2015 Q4/2020